Package Level Test

Package Level Test

Laser Diode Characterization System Model 58620

  • Full turnkey automated test for edge-emitting laser diodes
  • High precision and large capacity carrier, interchangeable with other automated equipment
  • Fully automated alignment for fiber-coupled tests

Laser Diode Burn-in and Reliability Test System Model 58604

  • Applicable for burn-in, reliability andlife testing
  • ACC and APC control modes
  • Individual channel driving and measurement
  • Driving current 500mA per channel and up
  • Precise temperature control up to 125 ℃
  • Individual module operation

TO-CAN/CoC Burn In System Model 58603

  • For Burn-In, Reliability and Life Testing
  • ACC and APC control modes

Laser Diode Reliability, Burn-In and Life-Test System Model 58602

  • Burn-In, Reliability and Life Testing
  • Up to 4608 Channels
  • Up to 20A per device

TO-CAN Package Inspection System Model 7925

  • It can inspect lens scratch, crack, particle and metal cap defect of TO-CAN package
  • Auto focus function can overcome height variation from tray or package
  • Defect criteria editor for versatile pass/fail criteria setting